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Published in 2018 at "Ultrasonics sonochemistry"
DOI: 10.1016/j.ultsonch.2018.04.010
Abstract: To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process…
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Keywords:
assisted soldering;
control intermetallic;
using 9zn;
formation ... See more keywords