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Published in 2021 at "Materials Letters"
DOI: 10.1016/j.matlet.2020.129036
Abstract: Abstract We made head-shaped Cu-Sn solder joints with diameters about 10 μm, 20 μm, and 50 μm and reflowed the samples at 240 oC, 260 oC, and 280 oC for 60 s to 600 s.…
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Keywords:
controlled reaction;
diffusion;
diffusion controlled;
small size ... See more keywords