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Published in 2019 at "Applied Thermal Engineering"
DOI: 10.1016/j.applthermaleng.2019.03.078
Abstract: Abstract With the rapid increase in power density for miniaturization and integration of electronic component, the liquid-cooled cold plate, shows difficulty in meeting the increasing heat demand of electronic chips. In this paper, a novel…
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Keywords:
heat;
spray cooling;
cooling module;
novel compact ... See more keywords