Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu–Ge solder alloy
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DOI: 10.1007/s10854-017-7511-4
Abstract: This paper explores the effects of Germanium (Ge) addition on the wetting behavior, copper dissolution, IMC formation, microstructure and mechanical behavior of SnCu alloy. Static copper dissolution was conducted as a function of contact time… read more here.
Keywords: copper dissolution; alloy; mechanical behavior; addition ... See more keywords
Effect of Pretreatment on Leaching Primary Copper Sulfide in Acid-Chloride Media
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DOI: 10.3390/min8010001
Abstract: The aim of this study was to improve the dissolution of copper sulfide ore composed mainly of chalcopyrite (1.21 wt %) and bornite (0.54 wt %) using a pretreatment before leaching. The effect of the… read more here.
Keywords: copper sulfide; copper; primary copper; copper dissolution ... See more keywords