Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy
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DOI: 10.1007/s10854-018-8906-6
Abstract: The Sn–3.5 wt%Ag alloy considered as a good alternative to Pb–Sn alloys. This study aims to investigate the effects of Cu or Sb additions by 3 or 5 wt% to melt-spun Sn–3.5%Ag alloy. Ternary melt-spun Sn–Ag–Cu and… read more here.
Keywords: mechanical thermal; alloy; thermal electrical; melt spun ... See more keywords