Condition monitoring and prediction of solution quality during a copper electroplating process
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DOI: 10.1007/s10845-018-1445-4
Abstract: This paper presents a method for the monitoring and prediction of the electrolyte quality during the process of copper electroplating. This is important in industry, as any deviation in the solution quality leads to a… read more here.
Keywords: copper electroplating; monitoring prediction; quality; solution quality ... See more keywords
1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia
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DOI: 10.1039/d2ra02274e
Abstract: Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate the… read more here.
Keywords: copper; hptt; tetrazole thione; copper electroplating ... See more keywords