Articles with "copper filled" as a keyword



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Thermal Analysis and Operational Characteristics of an AlGaN/GaN High Electron Mobility Transistor with Copper-Filled Structures: A Simulation Study

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Published in 2019 at "Micromachines"

DOI: 10.3390/mi11010053

Abstract: In this study, we investigated the operational characteristics of AlGaN/GaN high electron mobility transistors (HEMTs) by applying the copper-filled trench and via structures for improved heat dissipation. Therefore, we used a basic T-gate HEMT device… read more here.

Keywords: operational characteristics; algan gan; characteristics algan; copper filled ... See more keywords