Two-step fabrication of nanoporous copper films with tunable morphology for SERS application
Sign Up to like & getrecommendations! Published in 2018 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2017.08.117
Abstract: Abstract It is important to design and fabricate nanoporous metals (NPMs) with optimized microstructures for specific applications. In this contribution, nanoporous coppers (NPCs) with controllable thicknesses and pore sizes were fabricated via the combination of… read more here.
Keywords: fabrication nanoporous; nanoporous copper; two step; step fabrication ... See more keywords
Dual-functional porous copper films modulated via dynamic hydrogen bubble template for in situ SERS monitoring electrocatalytic reaction
Sign Up to like & getrecommendations! Published in 2019 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2019.07.241
Abstract: Abstract Dual-functional porous copper films were prepared by dynamic hydrogen bubble template (DHBT) technique to achieve in situ SERS monitoring of electrocatalytic reaction. The morphology and SERS activity of porous copper films were effectively modulated… read more here.
Keywords: dual functional; dynamic hydrogen; functional porous; porous copper ... See more keywords
Thickness effects on fatigue crack propagation in submicrometer-thick freestanding copper films
Sign Up to like & getrecommendations! Published in 2017 at "International Journal of Fatigue"
DOI: 10.1016/j.ijfatigue.2017.06.029
Abstract: Abstract To investigate the thickness effects on fatigue crack propagation properties and mechanisms of as-deposited submicrometer-thick freestanding metallic films, fatigue crack propagation experiments in freestanding copper films with a thickness B of approximately 100 nm were… read more here.
Keywords: fatigue crack; crack propagation; copper films; crack ... See more keywords
The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films
Sign Up to like & getrecommendations! Published in 2017 at "Thin Solid Films"
DOI: 10.1016/j.tsf.2016.11.047
Abstract: In this work we studied the impact of pulse electroplating parameters on the cross-sectional and surface microstructures of blanket copper films using electron backscattering diffraction and x-ray diffraction. The films evaluated were highly (111) textured… read more here.
Keywords: pulse plating; copper; influence pulse; stress ... See more keywords
Single-crystal copper films on sapphire
Sign Up to like & getrecommendations! Published in 2020 at "Thin Solid Films"
DOI: 10.1016/j.tsf.2020.138137
Abstract: Abstract Single-crystal copper films on sapphire have recently been reported upon in relation to graphene growth on these films. In the present paper the kinetics of the formation of single crystal copper films is investigated.… read more here.
Keywords: importance; crystal copper; single crystal; copper ... See more keywords
Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)
Sign Up to like & getrecommendations! Published in 2022 at "Nanotechnology"
DOI: 10.1088/1361-6528/ac96f8
Abstract: Nanotwinned copper is a potential microelectronic interconnection material due to its superior strength and conductivity, however, its filling ability is urgently needed to improve before its application in the field of advanced packaging. The effect… read more here.
Keywords: copper; thiazolinyl dithiopropane; sodium thiazolinyl; copper films ... See more keywords
Highly conductive copper films prepared by multilayer sintering of nanoparticles synthesized via arc discharge
Sign Up to like & getrecommendations! Published in 2023 at "Nanotechnology"
DOI: 10.1088/1361-6528/acbd1f
Abstract: The major challenges in producing highly electrically conductive copper films are the oxide content and the porosity of the sintered films. This study developed a multilayer sintering method to remove the copper oxides and reduce… read more here.
Keywords: copper; multilayer sintering; copper films; arc discharge ... See more keywords
Elucidating the Exceptional Passivation Effect of 0.8 nm Evaporated Aluminium on Transparent Copper Films
Sign Up to like & getrecommendations! Published in 2018 at "Frontiers in Materials"
DOI: 10.3389/fmats.2018.00071
Abstract: Slab-like copper films with a thickness of 9 nm (~70 atoms) and sheet resistance of ≤ 9 Ω sq−1 are shown to exhibit remarkable long-term stability toward air-oxidation when passivated with an 0. 8 nm… read more here.
Keywords: microscopy; copper; exceptional passivation; elucidating exceptional ... See more keywords
Sub-ps Laser Deposited Copper Films for Application in RF Guns
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16031267
Abstract: Copper thin films are intended to serve as a cover layer of photocathodes that are deposited by ablating copper targets in a high vacuum by temporally clean 600 fs laser pulses at 248 nm. The… read more here.
Keywords: copper; laser; copper films; sub laser ... See more keywords