Selective Electrochemical Etching of Stainless Steel Using a Laser-Patterned Copper Layer
Sign Up to like & getrecommendations! Published in 2019 at "International Journal of Precision Engineering and Manufacturing"
DOI: 10.1007/s12541-019-00099-9
Abstract: This paper proposes a novel electrochemical etching process without the need for a metal mask or photo-resist mask. The selective electrochemical etching using laser-patterned (SEEL) copper layer process consists of three steps: electrodeposition, laser patterning,… read more here.
Keywords: stainless steel; process; electrochemical etching; layer ... See more keywords
Enhancement of absorption in vertically-oriented graphene sheets growing on a thin copper layer
Sign Up to like & getrecommendations! Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2016.11.040
Abstract: Abstract The optical properties and surface structure of graphene films grown on thin copper Cu (1 μm) layer using chemical vapour deposition method were investigated via spectroscopic ellipsometry and nanoscopic measurements. Angle variable ellipsometry measurements were… read more here.
Keywords: layer; thin copper; enhancement absorption; oriented graphene ... See more keywords
Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer
Sign Up to like & getrecommendations! Published in 2023 at "ACS Omega"
DOI: 10.1021/acsomega.2c07365
Abstract: Parameters of DC-reactive magnetron sputtering are optimized to deposit anti-reflection (AR) layers on transparent polyimide (PI) substrates, followed by the deposition of the conductive copper layer, to fabricate practically reliable composite films as advanced flexible… read more here.
Keywords: adhesion strength; copper layer; copper; layer ... See more keywords