Early stages of copper microparticles electrodeposition on polypyrrole film
Sign Up to like & getrecommendations! Published in 2019 at "Composites Communications"
DOI: 10.1016/j.coco.2018.12.001
Abstract: Abstract In this work, we studied the electrodeposition of copper (Cu) microparticles on polypyrrole (PPy) films using cyclic voltammetry and chronoamperometry techniques. The initial stages of Cu deposition were investigated by performing current transients. Models… read more here.
Keywords: electrodeposition polypyrrole; early stages; copper; stages copper ... See more keywords
Gravimetric analysis of the autocatalytic growth of copper microparticles in aqueous solution
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DOI: 10.1039/c9ra06842b
Abstract: The growth kinetics of copper microparticles was analysed by using the gravimetric method. read more here.
Keywords: analysis autocatalytic; gravimetric analysis; autocatalytic growth; copper microparticles ... See more keywords
Experimental study on tensile strength of copper microparticles filled polymer composites printed by fused deposition modelling process
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DOI: 10.1108/rpj-08-2020-0199
Abstract: Purpose The purpose of this paper is to investigate the variables of the fused deposition modelling (FDM) process and improve their effect on the mechanical properties of acrylonitrile butadiene styrene (ABS) components reinforced with copper… read more here.
Keywords: tensile strength; fdm process; process; copper microparticles ... See more keywords
Conduction Conditions for Self-Healing of Metal Interconnect Using Copper Microparticles Dispersed with Silicone Oil
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DOI: 10.3390/mi14020475
Abstract: This study clarifies the conditions for the bridging and conduction of a gap on a metal interconnect using copper microparticles dispersed with silicon oil. An AC voltage applied to a metal interconnect with a gap… read more here.
Keywords: metal interconnect; copper microparticles; copper; voltage ... See more keywords