Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
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DOI: 10.1016/j.apsusc.2016.09.152
Abstract: Abstract A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and… read more here.
Keywords: copper; copper patterns; electroless plating; conductive copper ... See more keywords
Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds
Sign Up to like & getrecommendations! Published in 2021 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2021.149220
Abstract: Abstract Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink… read more here.
Keywords: electroless plating; copper; fabrication flexible; copper patterns ... See more keywords