A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-00961-6
Abstract: A new method for liquid-phase bonding of copper plates to an aluminum nitride (AlN) substrate was developed in this work. A newly developed proprietary interlayer composed of titanium and silver powders was deposited on the… read more here.
Keywords: liquid phase; method liquid; copper; new method ... See more keywords
Dynamic Response of Copper Plates Subjected to Underwater Impulsive Loading
Sign Up to like & getrecommendations! Published in 2019 at "Applied Sciences"
DOI: 10.3390/app9091927
Abstract: Understanding the mechanical response and failure behaviors of thin plates under impact loading is helpful for the design and improvement of thin plate structures in practical applications. The response of a copper plate subjected to… read more here.
Keywords: pre notch; copper plates; copper; response copper ... See more keywords
Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects
Sign Up to like & getrecommendations! Published in 2023 at "Materials"
DOI: 10.3390/ma16093311
Abstract: Soldering processes are applied in the fabrication of electronic circuits used in most modern domestic and industrial technologies. This article aims to introduce a new soldering technology based on the microwave joining of copper materials… read more here.
Keywords: copper plates; soldering low; microwave soldering; resistance ... See more keywords