Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
Sign Up to like & getrecommendations! Published in 2023 at "Molecules"
DOI: 10.3390/molecules28062783
Abstract: Levelers, as an essential part of organic additives in copper electroplating, play a crucial role in the fabrication of sophisticated interconnects in integrated circuits, packaging substrates, and printed circuit boards. In this work, four N-heterocyclic… read more here.
Keywords: performance correlation; copper; structure performance; leveler ... See more keywords