Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion-Barrier Materials of Ti-Based Alloys.
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DOI: 10.1021/acsami.0c14180
Abstract: To achieve high-performance thermoelectric (TE) devices, constructing good interfacial connection between TE materials and electrodes is as important as having high figure-of-merit TE materials. Although CoSb3-based TE devices have received great attention for power generation… read more here.
Keywords: cosb3; cosb3 based; diffusion barrier; mechanical strength ... See more keywords