LAUSR

CoSn3 Intermetallic Nanoparticles for Electronic Packaging

Sign Up to like & get
recommendations!
1 Published in 2022 at "Nanomaterials"

DOI: 10.3390/nano12224083

Abstract: At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn3 is a strong nucleating agent of Sn crystal, which has potential application value in… read more here.

Keywords: cosn3 intermetallic; cosn3; growth; electronic packaging ... See more keywords