Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints
Sign Up to like & getrecommendations! Published in 2022 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2021.125307
Abstract: Abstract High-density interconnection technology is critical for semiconductor packages, which require high speed and multifunctional demands. The shrinkage of solder volume is needed for the miniaturization of devices. Fewer studies investigate using Cu3Sn than Cu6Sn5… read more here.
Keywords: solder volume; cu3sn; type cu3sn; porous type ... See more keywords
Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
Sign Up to like & getrecommendations! Published in 2017 at "Materials Letters"
DOI: 10.1016/j.matlet.2016.10.017
Abstract: Abstract The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always… read more here.
Keywords: phase; cu3sn; soldering process; ultrasonic assisted ... See more keywords
Interfacial reaction during fabricating of full Cu3Sn joints in microelectronic packaging
Sign Up to like & getrecommendations! Published in 2017 at "Materials Science and Technology"
DOI: 10.1080/02670836.2017.1342365
Abstract: ABSTRACT Two copper substrates electroplated with Sn, both consisted of Cu/Sn + Sn/Cu structures, but they were bonded over different times in order to investigate the interfacial reaction. The growth morphologies of Cu6Sn5 and Cu3Sn were analysed,… read more here.
Keywords: reaction fabricating; cu3sn; fabricating full; reaction ... See more keywords