Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
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DOI: 10.1007/s11664-018-6481-5
Abstract: The morphological evolution and growth kinetics of interfacial Cu6Sn5 and Cu3Sn intermetallic compound (IMC) layers between Cu substrates and Sn-0.3Ag-0.7Cu-xMn (x = 0 wt.%, 0.02 wt.%, 0.05 wt.%, 0.1 wt.%, and 0.15 wt.%) (SAC0307-xMn) solders were investigated. After ageing, the uneven scallop-like… read more here.
Keywords: layer; cu6sn5 cu3sn; cu3sn layers; growth ... See more keywords