First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd3, Cu3Pd, and Cu4Pd
Sign Up to like & getrecommendations! Published in 2025 at "New Journal of Chemistry"
DOI: 10.1039/d5nj02120k
Abstract: Cu3Pd offers superior stiffness, thermal stability, and toughness, making it ideal for microelectronic packaging. In contrast, Cu4Pd provides greater ductility and thermal compliance for applications with large thermal fluctuations. read more here.
Keywords: cu3pd; stability; cu4pd; analysis structural ... See more keywords