Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9684-x
Abstract: This work studied the additions of nano-Cu6Sn5 intermetallic particles into a lead-free Sn3.0Ag0.5Cu (SAC305) solder alloy with content ranging from 0.05 to 2 wt%. The thermal behavior, mechanical properties and interfacial reaction of Cu6Sn5 nanoparticle containing… read more here.
Keywords: nanoparticles addition; thermal behavior; sn3 0ag0; solder ... See more keywords
Mechanism and control of preferred Cu6Sn5 growth on single crystal (001)Cu
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-03150-y
Abstract: Preferred orientation Cu6Sn5 prisms are usually formed on (001)Cu single crystal, making use of which can highly improve the packaging reliability of electronic devices. A practical method for morphology controlling of preferred orientation Cu6Sn5 was… read more here.
Keywords: mechanism; orientation; control; single crystal ... See more keywords
Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6481-5
Abstract: The morphological evolution and growth kinetics of interfacial Cu6Sn5 and Cu3Sn intermetallic compound (IMC) layers between Cu substrates and Sn-0.3Ag-0.7Cu-xMn (x = 0 wt.%, 0.02 wt.%, 0.05 wt.%, 0.1 wt.%, and 0.15 wt.%) (SAC0307-xMn) solders were investigated. After ageing, the uneven scallop-like… read more here.
Keywords: layer; cu6sn5 cu3sn; cu3sn layers; growth ... See more keywords
Diffusion anisotropy induced uneven regional growth of Cu6Sn5 IMC in Cu/SAC305/Cu micro solder joints under temperature gradient
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2021.161221
Abstract: Abstract Distinct uneven regional growth of interfacial Cu6Sn5 intermetallic compound (IMC) in Cu/Sn-3.0Ag-0.5Cu/Cu micro solder joints under temperature gradient (TG) was reported. The results revealed that thick and thin Cu6Sn5 IMC evenly formed at the… read more here.
Keywords: regional growth; cu6sn5; cu6sn5 imc; uneven regional ... See more keywords
Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient
Sign Up to like & getrecommendations! Published in 2020 at "Materials today communications"
DOI: 10.1016/j.mtcomm.2020.100928
Abstract: Abstract The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on… read more here.
Keywords: type cu6sn5; type; prism type; cu6sn5 ... See more keywords
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15082758
Abstract: Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead… read more here.
Keywords: addition; solder; growth; solder joints ... See more keywords