Effect of Intermetallic Content on Shear Deformation of Thin Sn-3.0Ag-0.5Cu Solder Micro-joints Between Copper Substrates
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DOI: 10.1007/s11664-018-6434-z
Abstract: In 3D electronic packages, stacked dies are connected vertically using through-silicon vias and solder micro-bumps, which are typically between 1 μm and 50 μm thick. Solder micro-joints undergo significant shear deformation due to various loading conditions, which… read more here.
Keywords: solder micro; deformation; cu6sn5 cu3sn; shear deformation ... See more keywords
Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
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DOI: 10.1007/s11664-018-6481-5
Abstract: The morphological evolution and growth kinetics of interfacial Cu6Sn5 and Cu3Sn intermetallic compound (IMC) layers between Cu substrates and Sn-0.3Ag-0.7Cu-xMn (x = 0 wt.%, 0.02 wt.%, 0.05 wt.%, 0.1 wt.%, and 0.15 wt.%) (SAC0307-xMn) solders were investigated. After ageing, the uneven scallop-like… read more here.
Keywords: layer; cu6sn5 cu3sn; cu3sn layers; growth ... See more keywords