Diffusion anisotropy induced uneven regional growth of Cu6Sn5 IMC in Cu/SAC305/Cu micro solder joints under temperature gradient
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DOI: 10.1016/j.jallcom.2021.161221
Abstract: Abstract Distinct uneven regional growth of interfacial Cu6Sn5 intermetallic compound (IMC) in Cu/Sn-3.0Ag-0.5Cu/Cu micro solder joints under temperature gradient (TG) was reported. The results revealed that thick and thin Cu6Sn5 IMC evenly formed at the… read more here.
Keywords: regional growth; cu6sn5; cu6sn5 imc; uneven regional ... See more keywords