Grain Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5 Investigated Using Molecular Dynamics Simulation
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DOI: 10.3390/ma15113889
Abstract: Intermetallic compounds (IMCs) are inevitable byproducts during the soldering of electronics. Cu6Sn5 is one of the main components of IMCs, and its mechanical properties considerably influence the reliability of solder joints. In this study, the… read more here.
Keywords: cu6sn5 investigated; mechanical properties; grain size; investigated using ... See more keywords