Elevated Temperature Behavior of CuPb18SbTe20/Nano-Ag/Cu Joints for Thermoelectric Devices
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DOI: 10.1007/s11664-018-6789-1
Abstract: The thermal stability of the CuPb18SbTe20 thermoelectric legs and Cu electrodes bonded through sintering of nano-silver (n-Ag) paste was investigated after isothermal annealing of the joint at 400°C and 500°C for different times. The legs,… read more here.
Keywords: cupb18sbte20; barrier layer; elevated temperature; temperature behavior ... See more keywords