Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn–Ag–Cu composite solder joints
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DOI: 10.1016/s1003-6326(21)65666-2
Abstract: Abstract To address the problem of floating and aggregation of Ag–GNSs in the molten pool during the traditional reflow soldering process, Cu/SAC/Ag–GNSs/Cu sandwich joints were prepared under an applied current density (1.0×104 A/cm2) for a… read more here.
Keywords: current bonding; solder joints; transient current; coated graphene ... See more keywords