The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-06907-8
Abstract: The growth behavior of intermetallic compound (IMC) in single crystal Sn3.0Ag0.5Cu (SAC305) and Sn3.0Ag3.0Bi3.0In (SABI333) ball grid array solder joints with Au/Ni/Cu pads under 104 A/cm2 current stressing was investigated. Characterization by scanning electron microscopy and… read more here.
Keywords: current stressing; solder joints; single crystal; crystal sn3 ... See more keywords
Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing
Sign Up to like & getrecommendations! Published in 2020 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2020.113995
Abstract: Abstract Due to the increasing miniaturization of microelectronic packaging, the electromigration (EM) phenomenon generally exists in microscale lead-free solder joints, which is mainly caused by high current stressing. To address the limitation of experimental measurement… read more here.
Keywords: current density; solder joints; temperature gradient; current stressing ... See more keywords