Investigation on Interface of CuW/Al Composite Using Ni Interlayer by Vacuum Hot-Pressing Diffusion Bonding
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DOI: 10.3390/met13061029
Abstract: In this study, the bonding of a CuW/Al composite with a Ni interlayer was designed and established by vacuum hot-pressing diffusion bonding. The interfacial microstructure was systematically discussed based on experimental characterization and first-principles calculations.… read more here.
Keywords: cuw composite; diffusion; hot pressing; vacuum hot ... See more keywords