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Interfacial reactions between Cu and Zn20Sn solder doped with minor RE

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Published in 2017 at "Journal of Materials Science: Materials in Electronics"

DOI: 10.1007/s10854-017-7647-2

Abstract: The interfacial microstructures between Zn–Sn solder alloys and Cu substrate were investigated, and the effect of rare earth (RE) elements on the interfacial microstructures between Zn–Sn solder alloys and Cu substrate were also studied. The… read more here.

Keywords: interfacial reactions; reactions zn20sn; solder; zn20sn solder ... See more keywords