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   Articles with "cycling tests" as a keyword



Study on influence of additive and host ions on deformation characteristics of alkali halide crystals by strain‐rate cycling tests during the Blaha effect

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recommendations! Published in 2017 at "Crystal Research and Technology"

DOI: 10.1002/crat.201600290

Abstract: Strain-rate cycling tests associated with ultrasonic oscillation were carried out between the strain rates (e) of 1.1×10−5 s−1 and 5.6×10−5 s−1 for NaBr:Li+ or K+ single crystals from 77 K up to the room temperature. Superposition… read more here.

Keywords: deformation; strain rate; rate; cycling tests ... See more keywords

Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

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recommendations! Published in 2017 at "Electronic Materials Letters"

DOI: 10.1007/s13391-017-7041-5

Abstract: The thermo-mechanical properties of microbumps serving as interconnects between Si chips in three-dimensional integrated circuits were examined in this study. Arrays of SnAg microbumps were subjected to temperature cycling tests up to 2500 cycles. Extensive… read more here.

Keywords: grain orientation; cycling; effect grain; cycling tests ... See more keywords

Failures of Cu-Cu Joints under Temperature Cycling Tests

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recommendations! Published in 2022 at "Materials"

DOI: 10.3390/ma15144944

Abstract: In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO2) were employed to seal the joints. Stress gradients induced in the joints with the… read more here.

Keywords: joints temperature; stress; cycling; temperature cycling ... See more keywords

Effect of Ag, Sn, and SiCN Surface Coating Layers on the Reliability of Nanotwinned Cu Redistribution Lines Under Temperature Cycling Tests

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recommendations! Published in 2024 at "Materials"

DOI: 10.3390/ma17225458

Abstract: Nanotwinned Cu (NT-Cu) is a promising candidate for Cu redistribution lines (RDLs). However, oxidation in NT-Cu lines is of concern because it increases electrical resistance and endangers the reliabilities of semiconductor devices such as temperature… read more here.

Keywords: resistance; coating layers; cycling tests; temperature cycling ... See more keywords