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Published in 2024 at "Journal of Materials Science"
DOI: 10.1007/s10853-024-10250-1
Abstract: In wide-bandgap semiconductor power device packaging, die bonding refers to attaching the die to substrate. Thereby, the process temperature of Ag sintering for the die bonding should be low to prevent damage to fragile dies.…
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Keywords:
temperature;
thermal decomposition;
decomposition temperature;
bonding performance ... See more keywords
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Published in 2021 at "Russian Physics Journal"
DOI: 10.1007/s11182-021-02284-8
Abstract: Sodium fluorouranates were studied to get the refined value of one of the fundamental constants with determination of differences between various uranium isotopes contained in these compounds. Such compounds as sodium heptafluorouranate can be classified…
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Keywords:
decomposition temperature;
decomposition;
sodium;
uranium isotopes ... See more keywords
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Published in 2021 at "Biochemical Engineering Journal"
DOI: 10.1016/j.bej.2021.108180
Abstract: Abstract Nowadays, MICP (Microbially Induced Calcite Precipitation) technology has broad application prospects in civil engineering, such as sand consolidation, crack healing in cement-based materials, solid waste treatment, etc. Nevertheless, there were no systematic studies on…
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Keywords:
decomposition temperature;
bio caco3;
chemical pathway;
adhesion force ... See more keywords