Investigation of the thermal deformation of a chip-scale packaged optical accelerometer
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DOI: 10.1016/j.measurement.2020.108017
Abstract: Abstract Accelerometers based on optical cavity have a complicated situation of thermal deformation, which significantly influences the measurement results. In order to minimize the thermal drift of the accelerometer, a preliminary multilayer structure package design… read more here.
Keywords: thermal deformation; deformation; deformation chip; chip scale ... See more keywords