Modeling Copper Plastic Deformation and Liner Viscoelastic Flow Effects on Performance and Reliability in Through Silicon Via (TSV) Fabrication Processes
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DOI: 10.1109/tdmr.2019.2940718
Abstract: Copper plastic deformation and liner viscoelastic flow effects on performance and reliability are studied for TSV-middle and backside TSV-last fabrication processes. Incremental plasticity model with nonlinear hardening and Maxwell viscoelasticity model are employed to characterize… read more here.
Keywords: copper; deformation liner; viscoelastic flow; plastic deformation ... See more keywords