Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
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DOI: 10.1177/1464420718784314
Abstract: The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of… read more here.
Keywords: eutectic growth; solders low; dendritic eutectic; low alloying ... See more keywords