Sinter bonding and formation of a near-full-density bondline at 250 °C via addition of submicrometer Cu particles to micrometer Ag-coated Cu particles
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DOI: 10.1007/s10854-020-04227-4
Abstract: Pressure-assisted die bonding at 250 °C in air using a paste containing 2 µm Ag-coated Cu particles (Cu@Ag) and 350 nm Cu particles was demonstrated for power device bonding. At a Cu@Ag-to-Cu mixing ratio of… read more here.
Keywords: near full; full density; coated particles; density bondline ... See more keywords