Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
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DOI: 10.3390/mi16080908
Abstract: The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes. This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly… read more here.
Keywords: embedded microchannel; power density; density semiconductor; semiconductor devices ... See more keywords