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Published in 2024 at "Nanotechnology"
DOI: 10.1088/1361-6528/ad1d13
Abstract: Controlling and preventing Cu oxidation is crucial for improving the performance and reliability of Cu–Cu bonding. Ni-B films were selectively deposited on Cu films to block the Cu oxidation. The resistivity changes of the Cu…
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Keywords:
resistance;
resistivity;
situ temperature;
dependent sheet ... See more keywords