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Published in 2023 at "Micromachines"
DOI: 10.3390/mi14061151
Abstract: In our work, we studied thin nickel films deposited by electroless plating for use as a barrier and seed layer in the through-silicon vias (TSV) technology. El-Ni coatings were deposited on a copper substrate from…
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Keywords:
organic additive;
electroless plating;
films deposited;
organic additives ... See more keywords