Design of a 3D Wilkinson power divider using through glass via technology
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DOI: 10.1088/1674-4926/39/12/125007
Abstract: Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this… read more here.
Keywords: design wilkinson; wilkinson power; glass; power ... See more keywords