Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices
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DOI: 10.3390/ma15041397
Abstract: Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead… read more here.
Keywords: die attachment; power; mechanical alloying; alloy pastes ... See more keywords