Interfacial Thermal Conductance between Cu and Diamond with Interconnected W-W2C Interlayer.
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DOI: 10.1021/acsami.2c07190
Abstract: Manipulating the interfacial structure is vital to enhancing the interfacial thermal conductance (G) in Cu/diamond composites for promising thermal management applications. An interconnected interlayer is frequently observed in Cu/diamond composites; however, the G between Cu… read more here.
Keywords: thermal conductance; structure; interfacial thermal; interlayer ... See more keywords