Ultraprecision grinding of silicon wafers using a newly developed diamond wheel
Sign Up to like & getrecommendations! Published in 2017 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2017.06.031
Abstract: Abstract The damaged layer of 160 nm in thickness is generated on a silicon (Si) wafer, which is the thinnest damaged layer ground by a conventional diamond wheel. This means that the nanoscale damaged layer can… read more here.
Keywords: diamond wheel; damaged layer; spectroscopy; diamond ... See more keywords
Online monitoring of truing arc-shaped diamond wheel by acoustic emission signal
Sign Up to like & getrecommendations! Published in 2018 at "Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture"
DOI: 10.1177/0954405416656908
Abstract: To realize the efficient and precision truing of arc-shaped diamond wheel, a novel on-machine precision form truing of arc-shaped diamond wheel is proposed utilizing rotary green silicon carbon rod, and online monitoring of the truing… read more here.
Keywords: shaped diamond; acoustic emission; arc shaped; truing arc ... See more keywords