Articles with "diamond wire" as a keyword



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Analysis of bead wear in diamond wire sawing considering the rock properties and production rate

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Published in 2017 at "Bulletin of Engineering Geology and the Environment"

DOI: 10.1007/s10064-017-1057-9

Abstract: Predicting the wear rate of diamond beads in the diamond wire sawing process is one of the most important factors in the optimized design and cost estimation of quarrying. This paper aims to predict the… read more here.

Keywords: rate diamond; wear rate; rate; diamond ... See more keywords
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Kinetic mechanism of aluminum removal from diamond wire saw powder in HCl solution.

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Published in 2019 at "Journal of hazardous materials"

DOI: 10.1016/j.jhazmat.2019.01.020

Abstract: Impurity removal is essential for the recovery and regeneration of silicon resources from diamond wire saw powder by metallurgical purification technologies. In this paper, the aluminum was removed from the diamond wire saw powder via… read more here.

Keywords: hcl; diamond wire; saw powder; wire saw ... See more keywords
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Recycling Si waste cut from diamond wire into high performance porous Si@SiO2@C anodes for Li-ion battery.

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Published in 2020 at "Journal of hazardous materials"

DOI: 10.1016/j.jhazmat.2020.124778

Abstract: The Si particle waste cut from diamond wire in photovoltaic industry is chose as an environmental friendly and low-cost resource for Li-ion battery. In this study, the pollutions of SiO2 layer, adhered trace metal and… read more here.

Keywords: cut diamond; waste cut; porous sio2; waste ... See more keywords
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Ultrasonication pretreatment of diamond wire sawn multi-crystalline silicon wafers for texturing

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Published in 2018 at "Materials Science in Semiconductor Processing"

DOI: 10.1016/j.mssp.2017.09.031

Abstract: Abstract Ultrasonication vibration as the pretreatment process, combined with wet acid etching, was utilized for the texture of diamond wire sawn (DWS) multi-crystalline silicon wafers. The SiC particles in the ultrasonic device were imposed for… read more here.

Keywords: wire sawn; silicon wafers; silicon; pretreatment ... See more keywords
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The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon

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Published in 2019 at "Materials Science in Semiconductor Processing"

DOI: 10.1016/j.mssp.2018.12.004

Abstract: Abstract Due to the existence of an acid etch resistant thin amorphous silicon layer over the smooth grooves of the diamond wire sawing polycrystalline silicon wafer surface, the anti-reflection effect is usually not ideal using… read more here.

Keywords: surface; removal; diamond wire; silicon ... See more keywords
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A metal-free additive texturization method used for diamond-wire-sawn multi-crystalline silicon wafers

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Published in 2020 at "Materials Science in Semiconductor Processing"

DOI: 10.1016/j.mssp.2020.105187

Abstract: Abstract Diamond-wire-sawn (DWS) technique has been widely applied in PV industry. However, this technique still has a big challenge when it is used for multi-crystalline silicon (mc-Si) because its reflectivity of DWS mc-Si etched by… read more here.

Keywords: crystalline silicon; wire sawn; multi crystalline; silicon ... See more keywords
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A new method of determining the slicing parameters for fixed diamond wire saw

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Published in 2020 at "Materials Science in Semiconductor Processing"

DOI: 10.1016/j.mssp.2020.105252

Abstract: Abstract The fixed diamond wire is widely used to slicing hard and brittle crystal material, such as mono-crystalline silicon, polycrystalline silicon, sapphire, silicon carbide, and so on. The slicing capability of fixed diamond wire should… read more here.

Keywords: wire; method; fixed diamond; diamond ... See more keywords
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Effects of H2O2, Cu(NO3)2 and HF temperatures on surface texturization of diamond-wire-sawn multicrystalline silicon wafer

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Published in 2020 at "Solar Energy Materials and Solar Cells"

DOI: 10.1016/j.solmat.2020.110583

Abstract: Abstract Previous studies have considered the same temperature for all components of the silicon etching solution, and the effect of the temperature of the individual components on the etching results has not been explored. In… read more here.

Keywords: silicon wafer; wafer; wire sawn; effects h2o2 ... See more keywords
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A metallurgical route to upgrade silicon kerf derived from diamond-wire slicing process

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Published in 2019 at "Vacuum"

DOI: 10.1016/j.vacuum.2019.02.019

Abstract: Abstract Silicon kerf generated during the diamond-wire slicing process contains various impurities and are considered industrial waste. In order to utilize the waste, a feasible process to purify silicon kerf by a combination of slag… read more here.

Keywords: process; diamond wire; silicon; wire slicing ... See more keywords
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A NOVEL METHOD FOR THE CHARACTERIZATION OF DIAMOND WIRE TOPOGRAPHY AND ABRASIVE GRAIN GEOMETRIES

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Published in 2019 at "MM Science Journal"

DOI: 10.17973/mmsj.2019_11_2019076

Abstract: Diamond wire is a relatively new abrasive tool technology used in wire sawing of hard and brittle materials i.e. Si, SiC, sapphire or ceramics in general. Process characteristics such as the undeformed chip thickness, abrasive… read more here.

Keywords: topography; diamond wire; wire; abrasive grain ... See more keywords
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Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing

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Published in 2023 at "Materials"

DOI: 10.3390/ma16041521

Abstract: Diamond wire sawing is widely used in processing NdFeB rare earth permanent magnets. However, it induces periodic saw marks and fracture chipping pits, which severely affect the flatness and surface quality of the products. In… read more here.

Keywords: diamond wire; surface; surface quality; wire sawing ... See more keywords