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   Articles with "die attach" as a keyword



Melamine-graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications.

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recommendations! Published in 2022 at "Nanoscale"

DOI: 10.1039/d2nr04557e

Abstract: With the ultra-fast development of personal portable electronic devices, it is important to explore new die attach film (DAF) materials in the limited mounting area and height in order to meet the requirements of a… read more here.

Keywords: graphene; graphene epoxy; melamine graphene; die attach ... See more keywords

Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles

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recommendations! Published in 2019 at "Applied Physics Letters"

DOI: 10.1063/1.5094073

Abstract: Sintered silver (Ag) die-attach has attracted much attention in assembling power modules for high power density and high temperature operation. We have investigated a method to improve the thermal stability of a sintered Ag die-attach… read more here.

Keywords: die attach; growth; thermal stability; structure ... See more keywords

Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications

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recommendations! Published in 2017 at "IEEE Transactions on Device and Materials Reliability"

DOI: 10.1109/tdmr.2017.2737829

Abstract: A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material… read more here.

Keywords: high power; stable sintered; power temperature; die attach ... See more keywords

Design, Test, and Evaluation of a Novel Die-Attach Structure for Packaging Stress Suppression of MEMS Resonant Accelerometers

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recommendations! Published in 2024 at "IEEE Transactions on Instrumentation and Measurement"

DOI: 10.1109/tim.2024.3470046

Abstract: An effective suppression of packaging stress is significant for MEMS-based inertial sensors in the application of high-performance navigation systems. This article proposes a novel glass gasket with an aim to cushion the die-attach thermal stress… read more here.

Keywords: mems resonant; packaging stress; stress; die attach ... See more keywords

Review of Die-Attach Materials for SiC High-Temperature Packaging

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recommendations! Published in 2024 at "IEEE Transactions on Power Electronics"

DOI: 10.1109/tpel.2024.3417529

Abstract: Silicon carbide (SiC) devices have shown definite advantages over Si counterparts in high-temperature, high-voltage, and high-frequency applications. To fully exploit the potentiality of SiC devices in high temperatures, die-attach materials that can withstand high temperatures… read more here.

Keywords: temperature; nps sintering; attach materials; high temperature ... See more keywords

Characteristics of Die-Attach Method by Sinter Bonding Using AG-40CU Mechanically Alloyed Particles

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recommendations! Published in 2019 at "Archives of Metallurgy and Materials"

DOI: 10.24425/amm.2019.127568

Abstract: Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sinter-bonding characteristics of a die-attach paste containing particles of these two representative conductive metals mixed at atomic scale. This resulted in… read more here.

Keywords: mechanically alloyed; alloyed particles; die attach; characteristics die ... See more keywords

Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors

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recommendations! Published in 2018 at "Materials"

DOI: 10.3390/ma11122531

Abstract: In this work, efforts were made to prepare a thermostable die-attach structure which includes stable sintered microporous Ag and multi-layer surface metallization. Silicon carbide particles (SiCp) were added into the Ag sinter joining paste to… read more here.

Keywords: attach structure; heat resistant; die attach; structure ... See more keywords

High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste

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recommendations! Published in 2022 at "Nanomaterials"

DOI: 10.3390/nano12193351

Abstract: Sintered silver (Ag) die-attach has attracted much attention in power systems with high power density and high operating temperature. In this paper, we proposed a novel surface modification method for Ag nanoparticles with organic amines… read more here.

Keywords: strength; sintering performance; die attach; pressureless sintering ... See more keywords