Melamine-graphene epoxy nanocomposite based die attach films for advanced 3D semiconductor packaging applications.
Sign Up to like & getrecommendations! Published in 2022 at "Nanoscale"
DOI: 10.1039/d2nr04557e
Abstract: With the ultra-fast development of personal portable electronic devices, it is important to explore new die attach film (DAF) materials in the limited mounting area and height in order to meet the requirements of a… read more here.
Keywords: graphene; graphene epoxy; melamine graphene; die attach ... See more keywords
Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles
Sign Up to like & getrecommendations! Published in 2019 at "Applied Physics Letters"
DOI: 10.1063/1.5094073
Abstract: Sintered silver (Ag) die-attach has attracted much attention in assembling power modules for high power density and high temperature operation. We have investigated a method to improve the thermal stability of a sintered Ag die-attach… read more here.
Keywords: die attach; growth; thermal stability; structure ... See more keywords
Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2017.2737829
Abstract: A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material… read more here.
Keywords: high power; stable sintered; power temperature; die attach ... See more keywords
Characteristics of Die-Attach Method by Sinter Bonding Using AG-40CU Mechanically Alloyed Particles
Sign Up to like & getrecommendations! Published in 2019 at "Archives of Metallurgy and Materials"
DOI: 10.24425/amm.2019.127568
Abstract: Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sinter-bonding characteristics of a die-attach paste containing particles of these two representative conductive metals mixed at atomic scale. This resulted in… read more here.
Keywords: mechanically alloyed; alloyed particles; die attach; characteristics die ... See more keywords
Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
Sign Up to like & getrecommendations! Published in 2018 at "Materials"
DOI: 10.3390/ma11122531
Abstract: In this work, efforts were made to prepare a thermostable die-attach structure which includes stable sintered microporous Ag and multi-layer surface metallization. Silicon carbide particles (SiCp) were added into the Ag sinter joining paste to… read more here.
Keywords: attach structure; heat resistant; die attach; structure ... See more keywords
High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste
Sign Up to like & getrecommendations! Published in 2022 at "Nanomaterials"
DOI: 10.3390/nano12193351
Abstract: Sintered silver (Ag) die-attach has attracted much attention in power systems with high power density and high operating temperature. In this paper, we proposed a novel surface modification method for Ag nanoparticles with organic amines… read more here.
Keywords: strength; sintering performance; die attach; pressureless sintering ... See more keywords