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   Articles with "die attachment" as a keyword



Characterization of Multiple Commercial Sintered-Silver Pastes as Die Attachment for Power Electronics Packaging: Materials, Processing, and Properties

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recommendations! Published in 2025 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"

DOI: 10.1109/jestpe.2024.3495815

Abstract: The low-temperature sintered-silver joining has emerged as an advanced die attachment technology for power electronics packaging. However, the industry still has great misgivings to completely adopt this technology. One of the barriers includes the confusion… read more here.

Keywords: power electronics; die attachment; sintered silver; electronics packaging ... See more keywords

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

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recommendations! Published in 2022 at "Materials"

DOI: 10.3390/ma15030914

Abstract: A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this… read more here.

Keywords: attachment power; paste based; die attachment; nanoparticles die ... See more keywords

Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

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recommendations! Published in 2022 at "Materials"

DOI: 10.3390/ma15041397

Abstract: Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead… read more here.

Keywords: die attachment; power; mechanical alloying; alloy pastes ... See more keywords

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

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recommendations! Published in 2022 at "IEEE Access"

DOI: 10.48550/arxiv.2206.07481

Abstract: Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and… read more here.

Keywords: die attachment; attachment wire; survey; detection ... See more keywords