A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15030914
Abstract: A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this… read more here.
Keywords: attachment power; paste based; die attachment; nanoparticles die ... See more keywords
Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices
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DOI: 10.3390/ma15041397
Abstract: Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead… read more here.
Keywords: die attachment; power; mechanical alloying; alloy pastes ... See more keywords
A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Access"
DOI: 10.48550/arxiv.2206.07481
Abstract: Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and… read more here.
Keywords: die attachment; attachment wire; survey; detection ... See more keywords