Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED
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DOI: 10.1007/s11664-018-6727-2
Abstract: In this study, a low-cost aluminum nitride (AlN) sintering process to produce thick AlN film substrate with a high thermal conductivity is developed. The thermal conductivity of the present produced thick AlN film substrate is… read more here.
Keywords: die; aluminum nitride; die bonding; bonding process ... See more keywords