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Published in 2022 at "Materials"
DOI: 10.3390/ma15051683
Abstract: This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP)…
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Keywords:
multi die;
warpage;
carrier;
fan wafer ... See more keywords