Low‐Dielectric SiO2/Polyimide Prepreg Composite With Enhanced Interfacial, Thermal, and High‐Frequency Properties
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DOI: 10.1002/app.57918
Abstract: A low‐dielectric prepreg composite was developed for high‐frequency electronic packaging by combining a thermally stable, modified polyimide (PI) matrix with silane‐functionalized SiO2 fillers. A radical crosslinking network was constructed using dicumyl peroxide (DCP) as the… read more here.
Keywords: prepreg composite; dielectric sio2; low dielectric; high frequency ... See more keywords