A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D IC
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DOI: 10.1109/lmwc.2018.2854552
Abstract: This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of the SD-TSVs up to 20… read more here.
Keywords: silicon vias; equalizer; passive equalizer; differential silicon ... See more keywords