Large-area Uniform 1-nm-level Amorphous Carbon Layers from 3D Conformal Polymer Brushes. A "Next-generation" Cu Diffusion Barrier?
Sign Up to like & getrecommendations! Published in 2022 at "Advanced materials"
DOI: 10.1002/adma.202110454
Abstract: A reliable method for preparing a conformal amorphous carbon (a-C) layer with a thickness of 1-nm-level, was tested as a possible Cu diffusion barrier layer for next-generation ultrahigh density semiconductor device miniaturization. A polystyrene brush… read more here.
Keywords: next generation; amorphous carbon; diffusion; barrier ... See more keywords
Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal
Sign Up to like & getrecommendations! Published in 2019 at "Advanced Electronic Materials"
DOI: 10.1002/aelm.201900314
Abstract: The epoch of flexible electronics demands new measures to interconnect electronic components and circuits under mechanical deformations such as bending, rolling, folding, and even stretching. Although liquid metal has been proposed as an alternative to… read more here.
Keywords: metal; liquid metal; diffusion barrier; solution ... See more keywords
A magnetron sputtered microcrystalline β-NiAl coating for SC superalloys. Part II. Effects of a NiCrO diffusion barrier on oxidation behavior at 1100 °C
Sign Up to like & getrecommendations! Published in 2017 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2017.02.245
Abstract: Abstract Arc ion plated-NiCrO interlayer was fabricated as an active diffusion barrier for microcrystalline β-NiAl coating on Ni-base single crystal Rene N5 superalloy. The effects of the NiCrO barrier layer on the cyclic oxidation behavior… read more here.
Keywords: barrier; oxidation; diffusion barrier; nial coating ... See more keywords
A limiting current oxygen sensor based on (La0.4Ce0.6O2-)0.96(FeO1.5)0.04 as dense diffusion barrier
Sign Up to like & getrecommendations! Published in 2019 at "Ceramics International"
DOI: 10.1016/j.ceramint.2019.01.139
Abstract: Abstract (La0.4Ce0.6O2-δ)0.96(FeO1.5)0.04 ((LCO)0.96(FeO1.5)0.04) and Y0.08Zr0.92O2 (8YSZ) powders were prepared by co-precipitation and used as dense diffusion barrier and solid electrolyte materials of a limiting oxygen sensor fabricated by a co-pressing and co-sintering method, respectively. The… read more here.
Keywords: diffusion barrier; diffusion; dense diffusion; oxygen sensor ... See more keywords
Fabrication of dense and defect-free diffusion barrier layer via constrained sintering for solid oxide fuel cells
Sign Up to like & getrecommendations! Published in 2017 at "Journal of The European Ceramic Society"
DOI: 10.1016/j.jeurceramsoc.2017.03.041
Abstract: Abstract To enable the development of next-generation solid oxide fuel cells (SOFCs), the fabrication of dense and defect-free diffusion barrier layers via constrained sintering has been a significant challenge. Here, we present a double layer… read more here.
Keywords: fabrication dense; layer; constrained sintering; diffusion barrier ... See more keywords
Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier
Sign Up to like & getrecommendations! Published in 2020 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2020.122848
Abstract: Abstract PbTe-based alloys are potential mid-temperature thermoelectric materials due to their excellent thermoelectric properties. Formation of intermetallic deteriorates mechanical joint strength and thermoelectric performance as well. In the present work, interfacial reaction, electrical and mechanical… read more here.
Keywords: thermoelectric materials; addition diffusion; diffusion barrier; addition ... See more keywords
Influence of additives on Cu thin films electrodeposited directly on Ti diffusion barrier in Cl-free electrolytes for Cu interconnect
Sign Up to like & getrecommendations! Published in 2017 at "Microelectronic Engineering"
DOI: 10.1016/j.mee.2017.02.006
Abstract: For Cu interconnect in Si-based microelectronic devices, seedless electrodeposition of Cu thin films directly on Ti diffusion barrier was investigated in Cl-free, citrate (Cit)-based acidic electrolytes with polyethylene glycol (PEG) or Janus Green B (JGB)… read more here.
Keywords: thin films; surface; directly diffusion; diffusion barrier ... See more keywords
The effect of the Re-Ni diffusion barrier on the adhesion strength and thermal shock resistance of the NiCoCrAlY coating
Sign Up to like & getrecommendations! Published in 2018 at "Surface and Coatings Technology"
DOI: 10.1016/j.surfcoat.2018.03.037
Abstract: Abstract The duplex coating system consisted of electroplated Re-Ni as the diffusion barrier layer and the thermally sprayed NiCoCrAlY coating deposited. The adhesion strength and thermal shock resistance of the NiCoCrAlY coatings with and without… read more here.
Keywords: thermal shock; diffusion barrier; nicocraly coating;
Diffusion barrier effect of Ta/Ti bilayer in organic dielectric/Cu interconnects
Sign Up to like & getrecommendations! Published in 2018 at "Thin Solid Films"
DOI: 10.1016/j.tsf.2018.03.025
Abstract: Abstract This study describes a Ta/Ti bilayer to improve the adhesion between Cu and a dielectric material and to enhance the barrier effect for Cu interconnects in electronic circuits. The addition of Ti improves the… read more here.
Keywords: barrier effect; diffusion barrier; bilayer;
Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion-Barrier Materials of Ti-Based Alloys.
Sign Up to like & getrecommendations! Published in 2020 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.0c14180
Abstract: To achieve high-performance thermoelectric (TE) devices, constructing good interfacial connection between TE materials and electrodes is as important as having high figure-of-merit TE materials. Although CoSb3-based TE devices have received great attention for power generation… read more here.
Keywords: cosb3; cosb3 based; diffusion barrier; mechanical strength ... See more keywords
Characteristics of an Amorphous Carbon Layer as a Diffusion Barrier for an Advanced Copper Interconnect.
Sign Up to like & getrecommendations! Published in 2019 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.9b15562
Abstract: The size of the advanced Cu interconnects has been significantly reduced, reaching the current 7.0 nm node technology and below. With the relentless scaling-down of microelectronic devices, the advanced Cu interconnects thus requires an ultrathin… read more here.
Keywords: barrier; diffusion; layer; amorphous carbon ... See more keywords