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Published in 2020 at "Advanced materials"
DOI: 10.1002/adma.202003276
Abstract: The increasing interest in flexible and wearable electronics has demanded a dramatic improvement of mechanical robustness in electronic devices along with high-resolution implemented architectures. In this study, a site-specific stress-diffusive manipulation is demonstrated to fulfill…
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Keywords:
integrated circuits;
diffusive manipulation;
stress diffusive;
thin film ... See more keywords