Emerging Three‐Dimensional Integrated Systems for Biomimetic Neural In Vitro Cultures
Sign Up to like & getrecommendations! Published in 2022 at "Advanced Materials Interfaces"
DOI: 10.1002/admi.202101297
Abstract: 3D in vitro neural cultures have gained interest in recent years as promising biomimetic micro‐environments which can regulate cell response to neural guidance cues. Several bioengineered technologies have been developed in combination with biomaterials to… read more here.
Keywords: vitro; cell; dimensional integrated; integrated systems ... See more keywords
Electromigration in three-dimensional integrated circuits
Sign Up to like & getrecommendations! Published in 2023 at "Applied Physics Reviews"
DOI: 10.1063/5.0139658
Abstract: The development of big data and artificial intelligence technology is increasing the need for electronic devices to become smaller, cheaper, and more energy efficient, while also having enhanced functionalities. However, the miniaturization of silicon chip… read more here.
Keywords: electromigration three; three dimensional; integrated circuits; dimensional integrated ... See more keywords
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2021.3064030
Abstract: Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few decades, driven in part by the techno-economic difficulties of dimensional scaling and the increasing interconnect delay in microelectronics. In a 3-D IC, vertical… read more here.
Keywords: research; dimensional integrated; three dimensional; heat transfer ... See more keywords
A Micro-Channel Cooling Model for a Three-Dimensional Integrated Circuit Considering Through-Silicon Vias
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DOI: 10.2174/1876402912666200123154001
Abstract: With the increase in the integration degree of the three-dimensional Integrated Circuit ( 3D I C) , the thermal power consumption per unit volume increases greatly, which makes the chip temperature rise. High temperature could… read more here.
Keywords: three dimensional; channel cooling; integrated circuit; dimensional integrated ... See more keywords
Thermal modeling and analysis of three-dimensional integrated circuits with irregular structure
Sign Up to like & getrecommendations! Published in 2023 at "Thermal Science"
DOI: 10.2298/tsci220805061r
Abstract: Considering the manufacturing and packaging process, three-dimensional integrated circuits design often requires irregular chip structures. Three-dimensional integrated circuits with irregular structures can facilitate differentiated chip design and reduce manufacturing costs. Highly complex through-silicon vias have… read more here.
Keywords: silicon vias; dimensional integrated; three dimensional; model ... See more keywords